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Application (examples)
・Various Sensors (Pressure, Acceleration, Gyro)
・Optical Devices (CMOS,CCD, LD and LED)
・Spacer Glass for WLP
・Glass filter and more
Features
● Compatible with various glass materials, holes shapesand thickness
● Small diameterhole processing(Min. Φ0.05mm)
● Achieve quality that meets your needs by adding variousoptions
Option
・Reduces microcracks that occur during glass processing (Reduces particle damage to devices)
・Enables to metalize hole side walls
・Metal patterning to the glass surface
・Control saggingaround the holes
・Reducing chipping (Able to minimize less than 10um)
・Managing Total Thickness Value