SIP

Company Profile

TECNISCO is process service provider of precision component. Sinceestablished, we have expanded the technical process field and generatedadvanced high-precision processes and composite technologies forsupporting in the field of Opto-telecommunication, Industrial lasers andMEMS devices industries. We are doing processing services and able tosupply customized parts that are manufactured with metal, ceramic, glassand silicon.TECNISCO's expertise includes: Dicing, Sandblasting, Milling (CNCmachining), Assembling (AuSn, AuGe, AgCuIn, AgCu), Polishing, Bonding,Metallization (Plating, Sputtering, Vapor deposition) forproducing such as CuW, CuMoCu, CuAlNCu, Cu heatsinks (for High power laserdiode ) and Structured glass wafer (for MEMS and Medical device).

Business typessuppliser
Business scope：
Established time2005-09-02

By E-mail

Laser Power Electronic Device MEMS Plates medical appliances

Microchannel cooler

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Insulation type Cu-AlN-Cu submounts

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High pressure seamless microchannels

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Through glass via (TGV)

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3D Glass Mettalization

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Si + Glass wafer

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Spacer glass

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Cavity glass / Cap glass

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Microfluidic glass

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