Potting Compound for ECU (Electronic Control Unit) Sensors
Automotive controllers contain densely packed internal components; power devices, in particular, generate continuous heat during operation. If this heat is not dissipated promptly, the resulting rise in internal temperature can compromise the reliability of chips, capacitors, inductors, and solder joints.
SIPA 1850 offers high thermal conductivity, facilitating the transfer of heat from components to the housing or heat-dissipating structures, thereby reducing the risk of localized heat accumulation.
Suitable for:
✅️ Automotive controller potting
✅️ Power module potting
✅️ Motor controller potting
✅️ Thermal management controller potting
✅️ New energy electronic module potting
Color: A: White; B: White. Thermal conductivity: 3.0/4.3 ± 0.2 W/m·K.
