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New Packaging Options for NTC Temperature Sensor Components

  • Product modelEP 2029 Structural Epoxy Adhesive
  • Product brand ELAPLUS
  • Apply area:Medical Equipment,Wearable Devices,Aged Care Facility,Marine Equipment,Petrochemical Industry,Electric Power,Light Industry,Special Industry,Equipment Manufacturing,Instrumentation and Measurement,Automation Cntrol,semiconductor,Nuclear Power,Metallurgy/Steel Industry,Machine Engineering,Telecommunication,Transportation and Road Administration,Internet of things,Smart Phone,Industry Robtot, Water Conservancy and Transportation,New energy(Wind Energy,Photovoltaik,Hydrogen,Geothermy etc.),Health Care Industry,Entertainment Equipment,Personal Computer,Service Robot,Education Robot,Rehabilitation Robot,Aviation,Food/Beverage/Medicine Industry,Boats and Ships,Outer Space and Sapce flight,Petroleum/Natural Gas,Fuel Cell,Energy Safty and Measurment,Energy Transportation,Underground Pipline,Smart Water,Water Supply and Drainage,Urban Rainstorm Waterlogging Management

SHANGHAI BEGINOR POLYMER MATERIAL CO.,LTD

China Shanghai Shanghai City

Product Details Product specification download

High-Temperature and High-Humidity Environments

Temperature sensors often operate across a wide temperature range of -50°C to 180°C while requiring long-term resistance to environmental factors such as moisture, dust, and oil. Standard encapsulation materials are prone to cracking, delamination, or performance degradation.

Mechanical Stress, Vibration, and Shock

NTC components are typically small and delicate, making them susceptible to vibration, shock, or installation-induced stress. If the encapsulation material is overly rigid or has poor flow characteristics, it can lead to component damage or poor electrical contact.

Multi-Material Bonding Requirements

Temperature sensor assemblies involve diverse materials—such as metals, ceramics, fiberglass cloth, aluminum, and plastics—requiring an encapsulant that offers both excellent wetting and high-strength bonding to prevent cracking caused by thermal expansion and contraction.

Yilian EP 2029 — An Ideal Solution for NTC Temperature Sensor Encapsulation

EP 2029A/B is a two-component (2:1 mix ratio) structural epoxy adhesive. It is thixotropic—meaning it does not sag or run after dispensing—making it highly suitable for encapsulating precision components.

Key advantages include:

High-Reliability Encapsulation: Withstands a wide temperature range (-50°C to 180°C) and maintains long-term physical and chemical stability.

Excellent Adhesion: Bonds exceptionally well to a variety of materials—including metals, ceramics, fiberglass cloth, plastics, and aluminum—reducing the risk of component cracking or delamination.


Versatile Applications:

Suitable for metal bonding, sealing ceramic membrane modules, potting soft magnetic units, joining aluminum honeycomb panels, and encapsulating high-temperature sensors.



Resistant to Environmental Degradation: Once cured, the adhesive withstands moisture, oil, and atmospheric elements. It is solvent-free and produces no curing by-products, thereby minimizing secondary contamination.


Ease of Use: Cures at room temperature or with heat; features a 100:50 mixing ratio (by weight). Its thixotropic design ensures precise dispensing, preventing sagging and material waste.


The reliability of a temperature sensor depends not only on the component itself but also on high-performance encapsulation materials. Through superior adhesion, broad temperature performance, and environmental resilience, EP 2029 provides secure, stable, and long-term protection for NTC components, ensuring the sensor remains accurate and reliable even in complex environments.


Yilian EP 2029—Making temperature sensor encapsulation more secure, professional, and durable.

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