SIGEL 1806 is a two-component silicone gel material specifically designed for the encapsulation of precision electronics and pressure sensors, effectively addressing the challenges mentioned above.

Key Advantages:

1:1 two-component silicone gel system

Simple mixing ratio; suitable for manual or automated dispensing and potting processes

Ultra-low hardness; penetration (1/10 mm) of 75

Cures into a flexible gel state, exerting virtually no mechanical stress on MEMS chips or sensitive diaphragms

Excellent stress relief and cushioning capabilities

Provides continuous protection for sensors against temperature fluctuations, vibration, and shock

Reliable environmental protection

Effectively isolates moisture and contaminants, enhancing the long-term stability and service life of pressure sensors

Target Applications:

Drone barometric pressure/altitude sensors

Force feedback and pressure sensing modules for humanoid robots and robotic dogs

CNC equipment and industrial automation pressure detection units

For pressure sensors, potting is not merely about "protection"; it is a critical process step that determines measurement stability and service life.

Through its low-stress, flexible gel encapsulation, SIGEL 1806 offers a more reliable and "sensor-friendly" packaging solution for pressure sensors in next-generation intelligent equipment.

Typical Applications

IC chip packaging and protection (e.g., power semiconductors, electronic sensors, MEMS top coating, automotive ECU integrated modules), undersea fiber optic potting, etc.

Processing Instructions

Weigh components A and B in a 1:1 ratio and mix thoroughly. Allow the mixture to stand or use a vacuum chamber to remove air bubbles, then dispense it into the components (or modules) requiring potting and protection.

Allow the potted components to stand; curing can be accelerated by heating (approximately 60 minutes at 80°C) or performed at room temperature (approximately 24 hours).

Precautions

Vacuum degassing the mixed A and B components can improve the performance of the cured product.

Reseal Component B tightly after use.

Low temperatures may slow down the curing process; heat curing is recommended.

Contact with materials containing sulfur, amines, or tin may inhibit the curing of SiGel 1806.

Suitable for potting various modules and power supplies.

Storage and Transportation

Store in a cool, dry place below 25°C. The shelf life for components A and B is one year when stored below 25°C.

Products exceeding the shelf life should be inspected for abnormalities before use.

This product is classified as non-hazardous and can be transported as a general chemical. Take precautions to prevent leakage during transport.