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Micro-structuring (Through & Blind Hole / Clear & Frosted Cavity)
ü Micro-structuring on wafers and substrates with holes and
cavities.
ü Hole diameter: Dia. 30 μm (0.03mm).
ü Cavity depth: 5 μm (0.005mm) with Clear or Frosted bottom.
ü Groove: 10 μm (0.01mm).
ü Processing by Sandblasting, Ultrasonic drilling, CNC, Wet
etching, Molding, and Laser to produce customized design
including cavity, groove, through hole, blind hole.