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TGV & TSV
ü Wafer size @ 4”, 6”, 8“, and 12“.
ü Thin glass 100um with fine hole drilling Dia. 30um.
ü Low-resistance metal dopped in the via or coating with liftoff.
ü Low to High CTE glass wafer available for TGV.
ü TSV insulation trench with Al2O3 or SiO2 barrier coating
for Si or Cu vias.
ü Applicable to SEMI and MEMS 3D IC interposer.