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TGV & TSV

  • Product model
  • Product brand Wenzhou Chinalux Technology
  • Apply area:Medical Equipment,Wearable Devices,Aged Care Facility,Marine Equipment,Petrochemical Industry,Electric Power,Light Industry,Special Industry,Equipment Manufacturing,Inter-city Rail Transport/Metro,Instrumentation and Measurement,Automation Cntrol,semiconductor,Warehouse,Nuclear Power,Metallurgy/Steel Industry,Machine Engineering,Telecommunication,Transportation and Road Administration,Internet of things,Smart Phone,Oil-fueled Automotive,Industry Robtot, Water Conservancy and Transportation,New energy(Wind Energy,Photovoltaik,Hydrogen,Geothermy etc.),Indoor Environment Monitoring,Health Care Industry,Entertainment Equipment,Personal Computer,Service Robot,Education Robot,Rehabilitation Robot,New Energy Vehicle,High-speed Train,Food/Beverage/Medicine Industry,Transportation,Retail,Petroleum/Natural Gas,Fuel Cell,Energy Safty and Measurment,Energy Transportation,Outdoor Environment Monitoring,Security Protection/Monitor,Exploration/Monitoring,Water/Sewage Disposal,Industry Environment Monitoring,Underground Pipline,Smart Water,Water Supply and Drainage,Urban Rainstorm Waterlogging Management

Shanghai MWaveSense Technology Co.,Ltd.

China Shanghai Shanghai City

Product Details Product specification download

ü Wafer size @ 4”, 6”, 8“, and 12“.

ü Thin glass 100um with fine hole drilling Dia. 30um.

ü Low-resistance metal dopped in the via or coating with liftoff.

ü Low to High CTE glass wafer available for TGV.

ü TSV insulation trench with Al2O3 or SiO2 barrier coating

for Si or Cu vias.

ü Applicable to SEMI and MEMS 3D IC interposer.


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