Please:Sign In
In-Between Laser Cutting
ü Applicable to clear crystal material, including Chemical
toughened glass, Borosilicate glass, Alkaline-free glass,
Sodalime glass, Silicon wafer, Sapphire (Al2O3),
Ceramic, ALN, etc.
ü Feasible for Compound materials (e.g. Glass + ALN).
ü Cutting for extra-thin glass from thickness 50um.
ü Through hole, blind hole, Grooving, Pre-cut, Alignment
mark, tracking number.
ü Straight cut edge (90°) with chipping < 10um.
ü Cutting width 10um and increase the material usage.
ü Low contamination cutting with high cleanliness.