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No Chipping Drilling
ü Micro-structuring on 2"~12" Wafers and substrates with holes and cavities.
ü Hole Diameter: Dia. 30 µm (0.03mm).
ü Cavity Depth: 5 µm (0.005mm) with clear or frosted bottom.
ü Groove: 10 µm (0.01mm).
ü Processing by Sandblasting, Ultrasonic drilling, CNC, Wet
etching, Molding, and Laser to produce customized design
including cavity, groove, through hole, blind hole.