The products are involved in fields such as defense industry, communication, automotive electronics, medical electronics, industrial control, signal processing, high-voltage surge suppression of power modules, and variable-speed motor control.

Dehydrogenation furnace:

① Working temperature: 200-600℃;

② Temperature uniformity ±5℃;

Eutectic sintering furnace:

① Maximum operating temperature: 450℃;

② Temperature uniformity ±5℃;

③ Temperature control accuracy ±1℃;

④ Ultimate vacuum degree: 5Pa;

⑤ Process gas: Nitrogen or formic acid.

Automatic dispensing and placement machine:

① Chip size: 0.3-25(mm);

② Repeat positioning accuracy in XY direction: ≤±0.001mm@3o;

③ Angle control accuracy: ≤±0.5°;

④ Mounting lift control: ≤0.5°;

⑤ Comprehensive picking and placing accuracy: ≤±0.015mm@3o(CPH standard mode).

Plasma cleaning

① Output effective power: 0-600W;

② Discharge vacuum degree: 20-50Pa.

Fully automatic gold wire ball welding and bonding machine:

① Welding positioning accuracy: ≤±3μ@3 °;

② Applicable wire diameter: 15-50μ;

③ Minimum solder joint diameter: ≥65μ(based on a 25μ wire diameter);

④ Minimum lead arc height: ≤65μ(based on a 25μ wire diameter).

Multi-functional wedge welding bonding machine:

①  welding wire diameter: aluminum wire (18 ~ 100 microns), gold (15 ~ 75 microns), gold belt x50 mu (12.7 m ~ 25.4 x300 microns), a specific alloy wire;

② Cavity depth range: Maximum 21mm;

③ Z-stroke of the bonding head: 19mm;

④ X-Y range of the bonding head: 15mm in the X direction and 15mm in the Y direction.

Parallel seam welding machine:

① Applicable tube shell size: (4~200)×(4~200)(mm);

② Adaptable to tube and shell shapes: rectangular, circular;

③ Applicable cover plate thickness: (0.1-0.15)mm.