The technology of LTCC involves grinding and casting low-temperature sintered ceramic powder into precisely thick and dense ceramic tapes. On these ceramic tapes, the required circuit patterns are fabricated through processes such as machine punching, laser drilling, through-hole filling, and precision conductor paste printing. Multiple passive components (such as low-capacitance capacitors, resistors, couplers, etc.) are embedded into multi-layer ceramic ceramic sheets. Then they are stacked together, sintered and cut at 850℃ to form high-density circuits that do not interfere with each other in three-dimensional space. Then, various packaged ics, bare chips and various active devices are mounted on their surfaces to make passive and active integrated functional modules, which can further miniaturize and high-density the circuits. It is particularly suitable for use in high-frequency communication components, high-frequency filters, and microwave antennas.

Substrate material:

Ferro A6M ceramic tape

Conductor slurry:

Ferro all-gold series and all-silver hybrid series

Resistance paste:

Ferro FX87- series