Thick-film hybrid integrated circuits are a type of micro-electronic functional component. They utilize ceramic substrates as the base material and various palladium-silver conductor pastes, platinum-silver conductor pastes, gold conductor pastes, and pinning resistor pastes, etc. To fabricate passive networks on the same substrate through thick film processes such as screen printing, 850-degree high-temperature sintering, and laser resistor adjustment. And on it, discrete semiconductor device chips, monolithic integrated circuits or micro-components are assembled, and then externally packaged to form a hybrid integrated circuit.

Substrate material:

96 porcelain, 99 porcelain, aluminum nitride, printed circuit boards, etc

Conductor slurry:

Palladium silver, platinum silver, gold, etc

Resistance paste:

Dupont 17 series, Heraeus R89 series, Xi 'an Hongxing R-8200 series resistance pastes, etc

Assembly:

SMT, gold wire/aluminum wire bonding, solder soldering, conductive adhesive bonding, eutectic bonding, etc

Encapsulation:

Epoxy coating, parallel sealing and welding